Biggest changeOur Products and Services Our core AmpliTech Inc. division offers products consisting of connectorized RF amplifiers and related subsystems, operating at frequencies from 50kHz to 44GHz, including low noise amplifiers, medium power amplifiers, cryogenic amplifiers, and custom assembly designs for the aerospace, governmental, defense and commercial satellite markets. 5 Our fully operational AGMDC division in Texas has successfully transferred our proprietary technology from connectorized products into monolithic microwave integrated circuits, (MMICs) and is offering in chip form, LNA’s, power amplifiers, filters, attenuators, thru lines and has the ability to provide custom design projects.
Biggest changeOur Products and Services Our core AmpliTech Inc. division offers products consisting of connectorized RF amplifiers and related subsystems, operating at frequencies from 50kHz to 44GHz, including low noise amplifiers (LNA’s), medium power amplifiers, cryogenic amplifiers, low noise block-down converters (LNB’s) and custom assembly designs for the aerospace, governmental, defense and commercial satellite markets.
The BDC assembly converts a Ka band signal, 17.7 GHz to 19.7 GHz, from the LNAs on either polarization of the antenna to between 950 and 2150 MHz using a high and low band block downconverter. 1:2 Tx Protection Switch Panel Subsystem The Specialty Microwave 1:2 Tx Protection Switch panel is a logic panel used in satellite communications earth stations.
The BDC assembly converts a Ka band signal, 17.7 GHz to 19.7 GHz, from the LNAs on either polarization of the antenna to between 950 and 2150 MHz using a high and low band block downconverter. 7 1:2 Tx Protection Switch Panel Subsystem The Specialty Microwave 1:2 Tx Protection Switch panel is a logic panel used in satellite communications earth stations.
Our hybrid design topologies include: ● Discrete Microwave Integrated Circuit (MIC) ● Pseudomorphic High Electron Mobility Transistor (PHEMT) ● MIC and Low Noise MIC We believe the discrete topology that we utilize provides various advantages: ● Can easily optimize Voltage Standing Wave Ratio (VSWR) and Noise Figure ● Flexibility of design; can easily adapt to change of specs, technology, etc. ● Low DC power consumption ● Can control and optimize gain flatness due to discrete gain stages ● Optimum use of MIC technology and experience 8 ● Use of negative bias is not necessary ● Specially selected components with specific parameters that yield proprietary results due to use in a particular configuration Research and Development To date, our research and development activities have primarily been conducted on new product designs to the extent as requested by the customers.
Our hybrid design topologies include: ● Discrete Microwave Integrated Circuit (MIC) ● Pseudomorphic High Electron Mobility Transistor (PHEMT) ● MIC and Low Noise MIC We believe the discrete topology that we utilize provides various advantages: ● Can easily optimize Voltage Standing Wave Ratio (VSWR) and Noise Figure ● Flexibility of design; can easily adapt to change of specs, technology, etc. ● Low DC power consumption ● Can control and optimize gain flatness due to discrete gain stages ● Optimum use of MIC technology and experience ● Use of negative bias is not necessary ● Specially selected components with specific parameters that yield proprietary results due to use in a particular configuration Research and Development To date, our research and development activities have primarily been conducted on new product designs to the extent as requested by the customers.
We believe that the RF semiconductor industry has the following features: High demand for complex, next-generation wireless signal processing applications. ● Mass adoption of internet and web-based applications, and other high-band width applications ● Ability to combine analog and digital signal processing into more integrated RF solutions ● Widespread application of low-cost, high-performance and functionality wireless networks ● Emergence of 5G/6G, WI-FI 6e, satellite and advanced wireless network infrastructure rollouts Growing opportunity for advanced RF subsystems, modules and components. ● Demand for precise, high-speed signal conditioning interfaces between analog and digital ● Combining analog/digital signal processing capabilities into more highly integrated solutions ● Widespread application of low-cost, high-performance wireless network systems ● Convergence of computing, communications, and consumer electronics with state-of-the-art signal processing capability with less power consumption Complements original equipment manufacturer, or OEM, design, and manufacturing capabilities. ● Deliver high quality and feature improvements that service provider requires 9 ● Lower production costs and shorten product development cycles ● Adhere to flexibility, performance, streamlined procurement processes and value requirements Current and Future Target Markets. ● High speed terrestrial and satellite terminals (SATCOM, “Internet in the Sky”) ● 5G/Wi-Fi6E and 6G wireless infrastructure (Cellular Base Stations, Small Cells, Private Wi-Fi Networks) ● IoT (Internet of Things) ● Cloud farms, big data and MEC architecture ● Quantum supercomputers/Quantum research ● Deep space astronomy ● Autonomous self-driving vehicles ● Telemedicine, AR/VR (Augmented and Virtual Reality) ● Drones, UAVs (Unmanned aerial vehicles) ● Cyber-security ● Military/Defense ECM/EW Competition We face competition in the amplifier industry from many established players.
We believe that the RF semiconductor industry has the following features: High demand for complex, next-generation wireless signal processing applications. ● Mass adoption of internet and web-based applications, and other high-band width applications ● Ability to combine analog and digital signal processing into more integrated RF solutions ● Widespread application of low-cost, high-performance and functionality wireless networks ● Emergence of 5G/6G, WI-FI 6e, satellite and advanced wireless network infrastructure rollouts Growing opportunity for advanced RF subsystems, modules and components. ● Demand for precise, high-speed signal conditioning interfaces between analog and digital ● Combining analog/digital signal processing capabilities into more highly integrated solutions ● Widespread application of low-cost, high-performance wireless network systems ● Convergence of computing, communications, and consumer electronics with state-of-the-art signal processing capability with less power consumption 10 Complements original equipment manufacturer, or OEM, design, and manufacturing capabilities. ● Deliver high quality and feature improvements that service provider requires ● Lower production costs and shorten product development cycles ● Adhere to flexibility, performance, streamlined procurement processes and value requirements Current and Future Target Markets. ● High speed terrestrial and satellite terminals (SATCOM, “Internet in the Sky”) ● 5G/Wi-Fi6E and 6G wireless infrastructure (Cellular Base Stations, Small Cells, Private Wi-Fi Networks) ● IoT (Internet of Things) ● Cloud farms, big data and MEC architecture ● Quantum supercomputers/Quantum research ● Deep space astronomy ● Autonomous self-driving vehicles ● Telemedicine, AR/VR (Augmented and Virtual Reality) ● Drones, UAVs (Unmanned aerial vehicles) ● Cyber-security ● Military/Defense ECM/EW Competition We face competition in the amplifier industry from many established players.
The capital balances have been retroactively adjusted to reflect the reverse acquisition. 4 AmpliTech designs, engineers and assembles microwave component based low noise amplifiers (“LNA”) that meet individual customer specifications. Application of the Company’s proprietary technology results in maximum frequency gain with minimal background noise distortion as required by each customer.
The capital balances have been retroactively adjusted to reflect the reverse acquisition. AmpliTech designs, engineers and assembles microwave component based low noise amplifiers (“LNA”) that meet individual customer specifications. Application of the Company’s proprietary technology results in maximum frequency gain with minimal background noise distortion as required by each customer.
The Company has both domestic and international customers in such industries as aerospace, governmental, defense and commercial satellite. On September 12, 2019, AmpliTech Group Inc. acquired substantially all of the assets of Specialty Microwave Corporation, a privately held company based in Ronkonkoma, NY. The purchase included all inventory, orders, customers, property and equipment, and goodwill.
The Company has both domestic and international customers in such industries as aerospace, governmental, defense and commercial satellite. 4 On September 12, 2019, AmpliTech Group Inc. acquired substantially all of the assets of Specialty Microwave Corporation, a privately held company based in Ronkonkoma, NY. The purchase included all inventory, orders, customers, property and equipment, and goodwill.
Our ability to compete successfully depends on numerous factors, including our ability to: ● maintain and increase our market share and the strength of our brand in amplifiers; ● maintain and expand our relationships with channel partners; ● secure products in large volume in a cost-effective and timely manner from our suppliers; ● develop innovative, differentiated, high-performance products relative to our competitors’ solutions; and ● protect our intellectual property. 10 We cannot assure you that our solutions will compete favorably or that we will be successful in the face of increasing competition from new products and enhancements introduced by our existing competitors or new companies entering our market.
Our ability to compete successfully depends on numerous factors, including our ability to: ● maintain and increase our market share and the strength of our brand in amplifiers; ● maintain and expand our relationships with channel partners; ● secure products in large volume in a cost-effective and timely manner from our suppliers; ● develop innovative, differentiated, high-performance products relative to our competitors’ solutions; and ● protect our intellectual property. 11 We cannot assure you that our solutions will compete favorably or that we will be successful in the face of increasing competition from new products and enhancements introduced by our existing competitors or new companies entering our market.
Trade Shows We attend trade shows such as IMS (International Microwave Symposium), European Microwave Symposium, MWC (Mobile World Congress) and the Satellite Show in Washington D.C. We also sponsor some trade shows to gain recognition and presence.
Trade Shows We attend trade shows such as IMS (International Microwave Symposium), European Microwave Symposium, MWC (Mobile World Congress) and the Satellite Show in Washington D.C. We may also sponsor some trade shows to gain recognition and presence.
Our manufacturing process in Hauppauge involves the assembly of numerous individual components and precise fine-tuning by production technicians. Our new manufacturing facility more than triples our capacity and still has room for expansion.
Our manufacturing process in Hauppauge involves the assembly of numerous individual components and precise fine-tuning by production technicians. Our manufacturing facility more than triples our capacity and still has room for expansion.
With a wide range of coupling ratios and frequency options, these directional couplers are ideal for a variety of applications, including telecommunications, radar systems, and aerospace technology. 7 Power Dividers Our power dividers stand as a testament to AmpliTech’s commitment to delivering innovative solutions through a strategic research and development business plan.
With a wide range of coupling ratios and frequency options, these directional couplers are ideal for a variety of applications, including telecommunications, radar systems, and aerospace technology. 8 Power Dividers Our power dividers stand as a testament to AmpliTech’s commitment to delivering innovative solutions through a strategic research and development business plan.
These rules may impose additional costs and may introduce new risks related to our ability to verify the origin of any conflict minerals used in our products. 11 Suppliers Our material consists of purchased component parts used in our assembly process or distributed.
These rules may impose additional costs and may introduce new risks related to our ability to verify the origin of any conflict minerals used in our products. 12 Suppliers Our material consists of purchased component parts used in our assembly process or distributed.
Key elements of our strategy include the following: ● Reorganization to have our shares traded on a national exchange to improve access to capital resources and a much broader customer base with higher volumes, as well as better access to large OEMs ● New product development ● Commercializing of existing core technology into specific high-volume technology sectors and obtaining patent on such technology Manufacturing and Distribution On April 1, 2022, we relocated our manufacturing facility and corporate office to Hauppauge, New York, while maintaining our distribution center in San Jose, California, and our MMIC design center in Plano, Texas.
Key elements of our strategy include the following: ● Trade on a national exchange to improve access to capital resources and a much broader customer base with higher volumes, as well as better access to large OEMs ● New product development ● Commercializing of existing core technology into specific high-volume technology sectors and obtaining patent on such technology Manufacturing and Distribution On April 1, 2022, we relocated our manufacturing facility and corporate office to Hauppauge, New York, while maintaining our distribution center in San Jose, California, and our MMIC design center in Plano, Texas.
However, recent cost inflation and potential supply chain disruptions may lead to higher material costs in fiscal 2024.
However, recent cost inflation, tariffs and potential supply chain disruptions may lead to higher material costs in fiscal 2025.
AGTGSS will also be providing full installation of Private 5G Networks (P5G) which includes the deployment of AmpliTech Group developed radio units. AGTGSS will implement AmpliTech’s low noise amplifier devices in these systems to promote greater coverage, longer range and faster speeds.
AGTGSS will also be providing full installation of Private 5G Networks (P5G) which includes the deployment of AmpliTech Group developed radio units. AGTGSS will implement AmpliTech’s low noise amplifier devices in these systems to promote greater coverage, longer range and faster speeds. Recent Board Change On January 17, 2025, Mr.
Research and development costs for the years ended December 31, 2023 and 2022 were $2,341,845 and $1,024,127, respectively. Industry and Competition Market Overview We operate our business in the industry of high-power RF semiconductors.
Research and development costs for the years ended December 31, 2024 and 2023 were $3,590,695 and $2,341,845, respectively. Industry and Competition Market Overview We operate our business in the industry of high-power RF semiconductors.
Government Regulation We are subject to the local, state and national laws and regulations of the jurisdictions where we operate that affect companies generally, including laws and regulations around commerce, intellectual property, trade, health and safety, commerce and contracts, privacy and communications, consumer protection, web services, tax, and state corporate laws and securities laws; and specifically those conducting business of electronics, many of which are still evolving and could be interpreted in ways that could harm our business.
We have both direct and indirect relationships with these customers domestically and abroad via exclusive and non-exclusive sales representatives. 13 Government Regulation We are subject to the local, state and national laws and regulations of the jurisdictions where we operate that affect companies generally, including laws and regulations around commerce, intellectual property, trade, health and safety, commerce and contracts, privacy and communications, consumer protection, web services, tax, and state corporate laws and securities laws; and specifically those conducting business of electronics, many of which are still evolving and could be interpreted in ways that could harm our business.
These new products will cover widely used standard frequency ranges in the 2.0 – 4 GHz, 4.0 – 8.00 GHz and 2-18 GHz offering unparalleled low noise figure and featuring its proprietary low noise MMIC technology by our AGMDC Division.
PHEMT MMIC Technology LNA’s AmpliTech’s new line of low noise amplifiers introduces high performance, high reliability MMIC-based designs. These new products will cover widely used standard frequency ranges in the 2.0 – 4 GHz, 4.0 – 8.00 GHz and 2-18 GHz offering unparalleled low noise figure and featuring its proprietary low noise MMIC technology by our AGMDC Division.
Our website has also been updated to include an e-commerce dashboard with access to purchase our products. Our website is available at www.amplitechgroup.com.
Our website has also been updated to include an e-commerce dashboard with access to purchase our products. Our website is available at www.amplitechgroup.com. Trade Magazines We advertise our products in Microwave Product Digest and Microwave Journal.
These amplifiers are very useful for applications that require the absolute minimum amounts of noise injection for the growing market of low temperature applications, such as quantum computing, medical applications, RF imaging, research & development, space communications, accelerators, radiometry and telephony. 6 Our re-designed cryogenic 4.0 – 8.0 GHz amplifiers for quantum computing have been tested and validated by a third-party laboratory for performance.
These amplifiers are very useful for applications that require the absolute minimum amounts of noise injection for the growing market of low temperature applications, such as quantum computing, medical applications, RF imaging, research & development, space communications, accelerators, radiometry and telephony.
Our Technology Our products are supported by hybrid design topologies that create highly linear RF products that amplify and transform signals with minimal addition of noise, achieving high Signal to Noise Ratio (“SNR”) and increased receiver sensitivity and range, at a low cost and low power consumption.
Overall, a 5G ORAN full radio network represents a shift towards more open, flexible, and interoperable infrastructure compared to traditional RAN architectures, potentially leading to cost savings, faster innovation cycles, and improved network performance. 9 Our Technology Our products are supported by hybrid design topologies that create highly linear RF products that amplify and transform signals with minimal addition of noise, achieving high Signal to Noise Ratio (“SNR”) and increased receiver sensitivity and range, at a low cost and low power consumption.
Trade Magazines We advertise our products in Microwave Product Digest and Microwave Journal. 12 Customers We serve a diverse customer base located primarily in the United States, Europe and South Asia, in the aerospace, governmental defense, commercial satellite and wireless industries. Some of our customers include Viasat, L3 Harris Technologies, CPI, Lockheed Martin, Microsemi, Cett Technology and Universal Enterprise.
Customers We serve a diverse customer base located primarily in the United States, Europe and South Asia, in the aerospace, governmental defense, commercial satellite and wireless industries. Some of our customers include Viasat, L3 Harris Technologies, CPI, Lockheed Martin, Microsemi, and Paramount Global. As of December 31, 2024, there was one customer that accounted for 13.97% of our total revenue.
The IC packaging also supports the electrical contacts, which connect the semiconductor device to a circuit board. IC packaging often gets sealed with lids, which creates an airtight seal to prevent contaminants, particles, liquids, or gases from entering the packaging to ensure the proper operation of the device.
IC packaging often gets sealed with lids, which creates an airtight seal to prevent contaminants, particles, liquids, or gases from entering the packaging to ensure the proper operation of the device. The Company offers multiple IC packaging and lids product lines according to desired product specifications, device performance, dimensions, resistances, and tolerances.
Their compact design and outstanding electrical performance make them an indispensable asset in RF design and experimentation. Ka Band LNB (Low-Noise Block Down Converter Unit) Featuring its proprietary AmpliTech LNA low noise technology, this Ka Band LNB was designed for superior performance in small sats, LEO, MEO, GEO and portable or fixed Ka-Band teleport applications.
Low-Noise Block Down Converter Units (LNB’s) Featuring its proprietary AmpliTech LNA low noise technology, these LNB’s, now available in the C band, X band and Ka band were designed for superior performance in small sats, LEO, MEO, GEO and portable or fixed Bands teleport applications.
Over 25 new MMIC chip technology products were released during 2023. In connection with the acquisition of our Specialty Microwave Division (SMW), we began designing and manufacturing passive microwave components and related subsystems that meet individual customer specifications for both domestic and international customers.
In connection with the acquisition of our Specialty Microwave Division (SMW), we began designing and manufacturing passive microwave components and related subsystems that meet individual customer specifications for both domestic and international customers. Our SSM division is a globally authorized distributor of IC packaging and lids for semiconductor device assembly, prototyping, testing, and production requirement.
This new phase array product supports 3.4-4.0 GHz and 2.496-2.69 GHz, with 8 x 4 x 2 = 64 Active Phased Array Elements. It is Digital Beam Forming Compliant With O-RAN/Keysight O-DU. This product uses proprietary technology comprised of existing core LNA products as well as MMICs from our AGMDC division in Texas.
Through our AGTGSS division, we are actively developing and currently manufacturing our newest product line of Open Radio Unit for Sub 6GHz. This new phase array product supports 3.4-4.0 GHz and 2.496-2.69 GHz, with 8 x 4 x 2 = 64 Active Phased Array Elements. It is Digital Beam Forming Compliant With O-RAN/Keysight O-DU.
We plan to use the information obtained from the IP story to file additional patents relating to our intellectual property and trade secrets. Employees As of March 13, 2023, we have forty-six (46) full time employees. From time to time, we may hire additional workers on a contract basis as the need arises. 13
We recently received three patents from the United States Patent and Trademark Office (USPTO), and we plan to use the information obtained from the IP story to file additional patents relating to our intellectual property and trade secrets. Human Capital Resources As of March 21, 2025, we have forty-six (47) full time employees.
The following table describes supplier concentration based upon the percentage of materials purchased from each supplier for 2023: Supplier A $ 1,751,735 33.14 % Supplier B 908,273 17.18 % Supplier C 800,132 15.14 % Supplier D 363,554 6.88 % Supplier E 236,303 4.47 % All other suppliers (approximately 104) 1,226,485 23.19 % Total $ 5,286,482 100 % Marketing We employ an aggressive and focused approach to market our products, at various venues including trade shows, strategic alliances, websites and trade magazines.
The following table describes supplier concentration based upon the percentage of materials purchased from each supplier for 2024: Supplier A $ 1,581,069 33.05 % Supplier B 559,044 11.69 % Supplier C 517,296 10.81 % Supplier D 436,008 9.11 % Supplier E 181,092 3.79 % All other suppliers 1,509,405 31.55 % Total $ 4,783,914 100 % Marketing We employ an aggressive and focused approach to market our products, at various venues including trade shows, strategic alliances, websites and trade magazines.
Cryogenic and Non-Cryogenic 4g/5g Small Cell Subsystems These products are utilized in private and public high-speed networks and airline WI-FI systems. IC Packaging Integrated circuit (“IC”) packaging is the case or enclosure that contains the semiconductor device, protecting it from corrosion or physical damage.
IC Packaging Integrated circuit (“IC”) packaging is the case or enclosure that contains the semiconductor device, protecting it from corrosion or physical damage. The IC packaging also supports the electrical contacts, which connect the semiconductor device to a circuit board.